Which IPC standard outlines the requirements for soldered assemblies?

The IPC standard that outlines the requirements for soldered assemblies is IPC J-STD-001. This standard establishes the materials, methods, and verification criteria for producing soldered electrical and electronic assemblies. It encompasses comprehensive guidelines relating to various aspects of solder processes, including preparation, soldering, and quality assurance. This makes it essential for ensuring high reliability in solder joints and is widely adopted in industries that require stringent quality control for electronic assemblies.

In contrast, IPC A-600 is focused on the acceptability of printed boards, IPC WHMA-A-620 addresses the requirements for cable and wire harness assemblies, and IPC-7711/7721 provides guidelines for rework and repair of printed circuit board assemblies. Each of these standards has a specific scope that does not encompass the soldering processes and requirements laid out in IPC J-STD-001. Thus, it is clear that for soldered assemblies, IPC J-STD-001 is the relevant standard.